ReFlex: a flexible smartphone with active haptic feedback for bend input

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

  • Paul Strohmeier
  • Jesse Burstyn
  • Juan Pablo Carrascal
  • Vincent Levesque
  • Roel Vertegaal
Original languageEnglish
Title of host publicationProceedings of the TEI '16 : Tenth International Conference on Tangible, Embedded, and Embodied Interaction
Number of pages8
PublisherAssociation for Computing Machinery
Publication date2016
Pages185-192
ISBN (Print)978-1-4503-3582-9
DOIs
Publication statusPublished - 2016
EventTenth International Conference on Tangible, Embedded, and Embodied Interaction - Eindhoven, Netherlands
Duration: 14 Feb 2016 → 17 Feb 2016
Conference number: 10

Conference

ConferenceTenth International Conference on Tangible, Embedded, and Embodied Interaction
Nummer10
LandNetherlands
ByEindhoven
Periode14/02/2016 → 17/02/2016

ID: 167582316