LaCir: A Multilayered Laser-cuttable Material to Co-fabricate Circuitry and Structural Components
Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review
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LaCir : A Multilayered Laser-cuttable Material to Co-fabricate Circuitry and Structural Components. / Buch, Niels Christian; Tejada, Carlos E.; Ashbrook, Daniel; Savage, Valkyrie.
CHI 2024 - Proceedings of the 2024 CHI Conference on Human Factors in Computing Sytems. Association for Computing Machinery, Inc., 2024. 340.Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review
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TY - GEN
T1 - LaCir
T2 - 2024 CHI Conference on Human Factors in Computing Sytems, CHI 2024
AU - Buch, Niels Christian
AU - Tejada, Carlos E.
AU - Ashbrook, Daniel
AU - Savage, Valkyrie
N1 - Publisher Copyright: © 2024 Copyright held by the owner/author(s)
PY - 2024
Y1 - 2024
N2 - Rapid prototyping is an important tool for designers, but many fabrication techniques are slow and create bulky components requiring multiple machines and processes to achieve desired device shape and electronic functionality. Prior work explored ways to ease fabricating shapes or designing electronics, but we focus on creating shape and electrical pathways at the same time from a single material and machine. LaCir leverages a three-layered, laser-cuttable material to incorporate circuits into the structural substrate of the design using laser cutters. Our substrate features a layer of conductive material sandwiched between thermoplastic sheets, allowing designers to cut electrical traces and assembleable, 3D object geometry in a single pass. We evaluate different composite materials, weighing their cuttability, ease of assembly, and conductivity; we also show using fully laser-cut joints as structural and electrical connections. We demonstrate LaCir's flexibility through several example artifacts.
AB - Rapid prototyping is an important tool for designers, but many fabrication techniques are slow and create bulky components requiring multiple machines and processes to achieve desired device shape and electronic functionality. Prior work explored ways to ease fabricating shapes or designing electronics, but we focus on creating shape and electrical pathways at the same time from a single material and machine. LaCir leverages a three-layered, laser-cuttable material to incorporate circuits into the structural substrate of the design using laser cutters. Our substrate features a layer of conductive material sandwiched between thermoplastic sheets, allowing designers to cut electrical traces and assembleable, 3D object geometry in a single pass. We evaluate different composite materials, weighing their cuttability, ease of assembly, and conductivity; we also show using fully laser-cut joints as structural and electrical connections. We demonstrate LaCir's flexibility through several example artifacts.
KW - Circuit Joinery
KW - Circuitry
KW - Digital Fabrication
KW - Laser Cutter
KW - Multimaterial Stack
KW - Prototyping
U2 - 10.1145/3613904.3642888
DO - 10.1145/3613904.3642888
M3 - Article in proceedings
AN - SCOPUS:85194865249
BT - CHI 2024 - Proceedings of the 2024 CHI Conference on Human Factors in Computing Sytems
PB - Association for Computing Machinery, Inc.
Y2 - 11 May 2024 through 16 May 2024
ER -
ID: 394531185